Results of the summarizing process for the arXiv paper: 2202.10015v2

This comprehensive review paper explores the use of Artificial Intelligence (AI) and Machine Learning (ML) algorithms in Very-Large-Scale Integration (VLSI) design and manufacturing. It addresses the challenges faced by the integrated circuit (IC) industry in the nanometer regime, particularly in reducing design complexity and minimizing chip manufacturing turnaround time. The paper provides an overview of existing literature on AI/ML algorithms for VLSI design and emphasizes their necessity and scope in enhancing CAD tools' capabilities. It systematically delves into different aspects of AI/ML applications at various abstraction levels, including circuit modeling, system-on-chip (SoC) design, physical design strategies like lithography and reliability analysis, yield prediction and management, as well as testing methodologies. The paper also discusses learning strategies proposed for handling complex data-intensive tasks using AI/ML algorithms. It highlights specific studies such as SVM-based macro models for characterizing transistor stacks of CMOS gates and digital circuit optimization frameworks utilizing ResNet-based approaches. In conclusion, this paper not only provides a detailed survey of existing AI/ML automated approaches but also outlines future opportunities and challenges for incorporating these advanced technologies to revolutionize VLSI design and manufacturing processes. By effectively leveraging AI/ML algorithms across different abstraction levels, it aims to enhance IC yield rates while reducing manufacturing turnaround times significantly.

• - Overview of AI/ML algorithms in VLSI design and manufacturing:
• - Addressing challenges in the nanometer regime
• - Enhancing CAD tools' capabilities
• - Applications of AI/ML at various abstraction levels:
• - Circuit modeling
• - System-on-chip (SoC) design
• - Physical design strategies like lithography and reliability analysis
• - Yield prediction and management
• - Testing methodologies
• - Learning strategies for complex data-intensive tasks using AI/ML algorithms:
• - SVM-based macro models for characterizing transistor stacks of CMOS gates
• - Digital circuit optimization frameworks utilizing ResNet-based approaches
• - Future opportunities and challenges for incorporating AI/ML technologies in VLSI design and manufacturing:
• - Enhancing IC yield rates
• - Reducing manufacturing turnaround times

SummaryAI and ML algorithms help in designing and making computer chips. They solve problems when making tiny things. They make computer tools better. AI and ML are used in different ways like drawing circuits, designing systems, and predicting how many chips will work. People use special ways to teach computers to do hard tasks with lots of data. Definitions- AI (Artificial Intelligence): Technology that helps computers think and learn like humans. - ML (Machine Learning): A type of AI that allows computers to learn from data. - VLSI (Very Large Scale Integration): Making computer chips with millions of tiny parts on them. - CAD (Computer-Aided Design): Using computers to design things. - Abstraction levels: Different ways of looking at something, from simple to complex. - Lithography: Process of printing tiny patterns on computer chips. - Reliability analysis: Checking if something works well without breaking. - Yield prediction: Guessing how many working chips can be made. - Testing methodologies: Ways to check if a chip works correctly. - SVM (Support Vector Machine): A type of algorithm used for classification tasks in ML. - CMOS gates: Basic building blocks in digital circuits. - ResNet: A type of deep learning model often used for image recognition tasks. - IC yield rates: How many good chips can be made out of all the ones produced. - Manufacturing turnaround times: How long it takes to make a product from start to finish.

Introduction: The field of Very-Large-Scale Integration (VLSI) design and manufacturing has seen significant advancements in recent years, with the continuous demand for smaller, faster, and more efficient integrated circuits (ICs). However, as the industry moves towards the nanometer regime, new challenges have emerged. These include increasing design complexity and longer chip manufacturing turnaround times. To address these challenges, researchers have turned to Artificial Intelligence (AI) and Machine Learning (ML) algorithms. In this comprehensive review paper, we will explore the use of AI/ML algorithms in VLSI design and manufacturing. We will discuss their necessity and scope in enhancing Computer-Aided Design (CAD) tools' capabilities and how they can revolutionize IC yield rates while reducing manufacturing turnaround times significantly. Overview of Existing Literature: The paper begins by providing an overview of existing literature on AI/ML algorithms for VLSI design. It highlights the need for advanced technologies to handle complex data-intensive tasks that traditional methods struggle with. The authors emphasize that incorporating AI/ML algorithms into CAD tools can greatly improve efficiency and accuracy in various aspects of VLSI design. AI/ML Applications at Different Abstraction Levels: The paper then delves into different aspects of AI/ML applications at various abstraction levels in VLSI design. This includes circuit modeling, system-on-chip (SoC) design, physical design strategies like lithography and reliability analysis, yield prediction and management, as well as testing methodologies. Circuit Modeling: One area where AI/ML algorithms have shown great potential is in circuit modeling. Traditional methods rely on manually crafted models that are often limited by human expertise or time constraints. In contrast, machine learning techniques can automatically learn from large datasets to create accurate models without human intervention. For example, SVM-based macro models have been proposed for characterizing transistor stacks of CMOS gates. These models showed improved accuracy compared to traditional approaches, while also reducing the time and effort required for model development. System-on-Chip (SoC) Design: AI/ML algorithms have also been applied to SoC design, which involves integrating multiple components onto a single chip. This process can be complex and time-consuming, but AI/ML techniques can help optimize the design by considering various factors such as power consumption, performance, and area constraints. Physical Design Strategies: In physical design strategies like lithography and reliability analysis, AI/ML algorithms have shown promise in improving efficiency and accuracy. For example, deep learning-based approaches have been proposed for optimizing lithography processes by predicting mask patterns with high accuracy. Yield Prediction and Management: Another crucial aspect of VLSI design is yield prediction and management. Traditional methods rely on statistical models that may not accurately capture the complexities of modern ICs. In contrast, AI/ML algorithms can handle large datasets with ease and provide more accurate predictions of yield rates. Testing Methodologies: Finally, the paper discusses testing methodologies where AI/ML algorithms have been used to improve test coverage while reducing test costs. These techniques involve using machine learning to identify critical paths in a circuit that require thorough testing. Learning Strategies: The paper also highlights specific learning strategies proposed for handling complex data-intensive tasks using AI/ML algorithms. These include supervised learning methods such as Support Vector Machines (SVMs) and unsupervised learning methods like clustering techniques. The authors discuss how these strategies can be applied at different abstraction levels in VLSI design to achieve better results. Future Opportunities and Challenges: In conclusion, this paper not only provides a detailed survey of existing AI/ML automated approaches but also outlines future opportunities and challenges for incorporating these advanced technologies into VLSI design and manufacturing processes. The authors highlight the potential benefits of leveraging AI/ML algorithms across different abstraction levels to enhance IC yield rates while reducing manufacturing turnaround times significantly. Conclusion: The use of AI/ML algorithms in VLSI design and manufacturing has shown great potential in addressing the challenges faced by the IC industry in the nanometer regime. This comprehensive review paper provides a detailed overview of existing literature on AI/ML algorithms for VLSI design and highlights their necessity and scope in enhancing CAD tools' capabilities. By effectively leveraging these advanced technologies, researchers aim to revolutionize VLSI design and manufacturing processes, leading to more efficient and accurate ICs.